[Overview]
This equipment is for automated optical inspection system for semiconductor device wafers.
By using On-Fly measurement mode, system perform high speed and high accuracy
visual inspection for such as pattern defects, contamination, cracks.
By running in parallel with the Wafer Review System, the pre-shipment inspection
will be able to perform without reducing inspection throughput.
By AI function, it learns the state of true defects, so it accurately sorts suspicious defects
and improves the yield.
[Use]
Chip Visual Inspection
Internal Defect Inspection (IR Inspection)
[Specification]
Available wafer size
4 inch, 6 inch
8 inch, 12 inch Wafer with Dicing Ring Frames, TAIKO Grind wafer