Full Automatic type(for 2-12 inch or Square shape)
[Overview]
This equipment is adopted an original UV optical system optimized for high-definition exposure and a mechanism
that allows the photo-mask and wafer to be paralleled with high precision.
This Full Automatic Exposure System support 3 kinds of Gap control such as “Vacuum contact”, “Soft Contact”, and “Proximity Gap”.
[Use]
Power device, Back side of C-MOS, MEMS, LED, Ceramics etc.
[Specification]
Available Wafer size : 12 inch, 6-8 inch, 4-6 inch, 2-4 inch or Square shape etc.
Loading method : Cassette to Cassette, Foup Load
Alignment direction : Top side, Back side (Option)
Alignment Accuracy : Top side ±0.8μm or less / Back side ±1μm or less
[Video of Inspection Equipment for 2-4inch Wafer]
[Video of Inspection Equipment for 12inch Wafer]