Wafer Review Equipment

Wafer Review Equipment

[Overview]
Device for detailed analysis of NG images, storage of analysis data, and communication with host PC based on information provided by wafer inspection system.

[Use]
Defect management in semiconductor device / CMOS device manufacturing process

[Specification]
Applicable work size: 12 inch / 8 inch
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Work state: Wafer dicing
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Stage positioning accuracy: ± 1um
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Review accuracy: 3σ ≤ ± 20um
* Positioning accuracy for defect information coordinates
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Throughput: Approximately 2000 seconds (10-sheet processing)
* Number of defects: 100 / piece
* Reference imaging mode
* Depends on defect location
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Review (moving to AF to imaging) time: fastest 0.5 seconds
* Depends on defect location
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The System takes defect images and the datum are uploaded to the upstream system.
The defect infomation is provided by Wafer Review System and Wafer Inspection System; AVI.
The System also analyzes the defect information from AVI.
Seiwa SAWR Series inspect your application at high speed with high precision.
We can also manufacture AVI.